PCT-150 CRS is the new Coater and Developer tool with Central Random Robot arm access and modules Stack-up.
The combination of PLC controller and PC take dual advantages of reliability, monitoring & data entry with Touch Screen Monitor and Graphical User Interface (G.U.I).
Flexible configuration (can be changed on demand), for all kinds of lithography process.
PCT-150 CRS
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Cluster tool tracks
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Flexible Process Flows
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OMRON PLC, Servo Controller system is designed integrated with high precision
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Dual Central Robot Arm with dual tongue (Operational Independence)
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Easy Maintenance
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High Throughout
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Reduced Chemical Consumption
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Vexta Stepper Motor
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Microsoft Windows OS platform
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Standard Configuration:
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2 Coater
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2 Developer
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6 HPO
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2 CP
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4 Indexer
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- Wafer size up to 150mm
Spin Performance Spin Speed:
- COAT Max. 8.000 rpm. Accuracy +/- 1 rpm
- DEV Max. 8.000 rpm. Accuracy +/- 1 rpm
Acceleration:
- COAT Max. 50.000 rpm/sec
- DEV Max. 50.000 rpm/sec
Number of dispenses COAT:
- Photo-resist up to 5 nozzles
- Top EBR nozzle
- Bottom EBR nozzle
Number of dispenses DEV:
- DEV Liquid up to 4 nozzles (Dual Spray, Dual Stream)
- Back Side Rinse nozzle
- Top Rinse nozzle
- Dev Fluid Temp. control (option*)
Dispense method:
- Pressurized Canister/Pump dispense
Process Recipes:
- Unlimited.
- Import/Export Recipe
**Central Random Robot Arm is handled by Smart Step Servo and Stepper Motor.
**Spinner with high torque servo motor (fixed mounting) is special sub-micron process.
High Temperature HPO Process Station Temperature:
- 50.0 ~ 250.0 °C, Temperature Uniformity <=0.2 °C at 50.0 ~ 120.0 °C (on wafer)
Rapid Temperature Change:
- ΔT: 50 °C <= 180 sec (Ramp Up/Down).
Bake method:
- Proximity
- Contact
Low Temperature HPO Process Station Temperature:
- 50.0 ~ 200.0 °C, Temperature Uniformity <=0.4 °C at 50.0 ~ 120.0 °C
Bake method:
- Proximity
- Contact
Chill Plate Process Station Temperature:
- 10.0 ~ 30.0 °C, Temperature Uniformity <=0.4 °C.
Cool method:
- Contact
